Ram hyperx 8gb ddr3 ทำไมไม ม ค า latency

Learn how to read Kingston® memory part numbers including Kingston FURY™, Server Premier™, ValueRAM®, HyperX®, DDR5, DDR4, DDR3, DDR2 and DDR memory product lines to help you identify modules by specification.

Part Number: KF556C38BBE2AK2-32

KF = Product Line

KF – Kingston FURY

56 = Speed (MT/s{{Footnote.A65242}})

48 – 4800
52 – 5200
56 – 5600
60 – 6000
64 – 6400
68 – 6800
72 – 7200

C = Module Type

C – UDIMM (Non-ECC Unbuffered)
S – SODIMM (Non-ECC Unbuffered)
R – EC8 RDIMM (x80)

38 = CAS Latency

32 – CL32
36 – CL36
38 – CL38
40 – CL40

B = Series

B – Beast
I – Impact
R – Renegade

B = Heat Spreader

B – Black
S – Silver
W – White

E = Profile Type

Blank - Intel XMP / Plug N Play
E - AMD EXPO

2 = Revision

Blank - 1st Revision
2 - 2nd Revision
3 - 3rd Revision

A = RGB

Blank – Non-RGB
A – RGB

K2 = Kit + number of pieces

Blank – Single Module
K2 – Kit of 2 Modules
K4 – Kit of 4 Modules
K8 – Kit of 8 Modules

16 = Total Capacity

8 – 8GB
16 – 16GB
32 – 32GB
64 – 64GB
128 – 128GB
256 – 256GB

Part Number: KSM48R40BD4TMP-64HMR

KSM = Product Line

KSM - Kingston Server Premier

48 = Speed (MT/s{{Footnote.A65242}})

48 – 4800
52 – 5200
56 – 5600

R = Module Type

E – EC4 UDIMM (x72)
L – EC8 LRDIMM (x80)
P – EC4 RDIMM (x72)
R – EC8 RDIMM (x80)
T – EC4 SODIMM (x72)

40B = CAS Latency

40B – CL40-39-39
42 – CL42-42-42
46B – CL46-45-45

D = Ranks

S – Single
D – Dual
Q – Quad

4 = DRAM Type

4 – x4
8 – x8

T = PMIC

I – Renesas
K – RichTek
M – Montage
P – MPS
T – TI

M = SPD Hub

I – Renesas
M – Montage
R – Rambus

P = Thermal Sensor

I – Renesas
M – Montage
P – MPS
R – Rambus

64 = Total Capacity

16 – 16GB
32 – 32GB
64 – 64GB
128 – 128GB

H = DRAM Manufacturer

H – SK Hynix
M – Micron
S – Samsung

M = DRAM Die Revision

A – A Die
C – C Die
E – E Die
M – M Die

R = Register

I – Renesas
M – Montage
R – Rambus

Part number: KVR48U40BS8K2-32X

KVR = Product lineM

KVR – Kingston ValueRAM

48 = Speed (MT/s{{Footnote.A65242}})

48 – 4800
52 – 5200
56 – 5600
60 – 6000

U = Module type

U – DIMM (Non-ECC Unbuffered)
S – SO-DIMM (Non-ECC Unbuffered)

40B = CAS Latency

40B – CL40
42B – CL42
46B – CL46

S = Ranks

S – Single Rank
D – Dual Rank

8 = DRAM Type

8 – x8
6 – x16

K2 = Kit + Number of pieces

Blank – Single module
K2 – Kit of 2 modules
K4 – Kit of 4 modules

32 = Total capacity

8 – 8GB
16 – 16GB
32 – 32GB
64 – 64GB
128 – 128GB
256 – 256GB

X = Customisation

Blank – Standard Pack
BK – Bulk pack

Part number: KF432C16BB1AK4/64

KF = Product line

KF - Kingston FURY

4 = Technology

3 - DDR3
4 - DDR4

32 = Speed (MT/s{{Footnote.A65242}})

16 - 1600 (1.5V)
16L - 1600 (1.35V)
18 - 1866 (1.5V)
18L - 1866 (1.35V)
26 - 2666
32 - 3200
36 - 3600
37 - 3733
40 - 4000
42 - 4266
46 - 4600
48 - 4800
50 - 5000
51 - 5133
53 - 5333

C = Module type

C - UDIMM (Non-ECC Unbuffered)
S - SODIMM (Non-ECC Unbuffered)

16 = CAS latency

9 - CL9
10 - CL10
11 - CL11
13 - CL13
15 - CL15
16 - CL16
17 - CL17
18 - CL18
19 - CL19
20 - CL20

B = Series

B - Beast
R - Renegade
I - Impact

B = Heat spreader

Blank - Blue
B - Black
R - Red
W - White

1 = Revision

Blank - 1st revision
1 - 16GB module(s) with 1Gx8 (8Gbit) components
2 - 2nd revision
3 - 3rd revision
4 - 4th Revision

A = RGB

Blank - Non-RGB
A - RGB

K4 = Kit + number of pieces

Blank – Single module
K2 - Kit of 2 modules
K4 - Kit of 4 modules
K8 - Kit of 8 modules

64 = Total capacity

4 - 4GB
8 - 8GB
16 - 16GB
32 - 32GB
64 - 64GB
128 - 128GB
256 - 256GB

Part Number: KSM26RD4L/32HAI

KSM = Product Line

KSM – Kingston Server Premier

26 = Speed (MT/s{{Footnote.A65242}})

24 – 2400
26 – 2666
29 – 2933
32 – 3200

R = Module Type

E – Unbuffered DIMM (ECC)
R – Registered DIMM
L – Load Reduced DIMM
SE – Unbuffered SODIMM (ECC)

D = Ranks

S – Single
D – Dual
Q – Quad

4 = DRAM Type

4 - x4
8 - x8

L = Profile

L - Very Low Profile DIMM

32 = Total Capacity

8 – 8GB
16 – 16GB
32 – 32GB
64 – 64GB
128 – 128GB
256 – 256GB

H = DRAM Manufacturer

H - SK Hynix
M - Micron

A = DRAM Die Revision

A – A Die
B – B Die
E – E Die

I = Register Manufacturer

I – IDT
M – Montage
R – Rambus

Part Number: KVR21LR15D8LK2/4HBI

KVR = Kingston ValueRAM

KVR - Kingston ValueRAM

21 = Speed (MT/s{{Footnote.A65242}})

21 - 2133
24 - 2400
26 - 2666
29 - 2933
32 - 3200

L = Low Voltage

blank – 1.2V
L - TBD

R = Module Type

E - Unbuffered DIMM (ECC) w/Thermal Sensor
L - Load-Reduced DIMM (LRDIMM)
N - Unbuffered DIMM (non-ECC)
R - Registered DIMM with Address/Command Parity Function w/Thermal Sensor
S - SO-DIMM, Unbuffered (Non-Ecc)

15 = CAS Latency

15 – CL15
19 – CL19
22 – CL22

D = Ranks

S – Single Rank
D – Dual Rank
Q – Quad Rank
O – Octal Rank

8 = DRAM Type

4 – x4
8 – x8
6 – x16

L = Profile

blank - any height
H – 31.25mm
L – 18.75mm (VLP)

K2 = Kit + Number of pieces

blank – Single Module
K2 – Kit of Two Modules
K3 – Kit of Three Modules

4 = Total Capacity

4 – 4GB
8 – 8GB
16 – 16GB
32 – 32GB

H = DRAM MFGR

H - SK Hynix
K - Kingston
M - Micron
S - Samsung

B = Revision

B – Revision

I = Intel Certified

I - Intel Certified

Part number: CBD48S40BD8MA-32

CBD = Product line

CBD – Kingston design-in DRAM module

48 = Speed (MT/s{{Footnote.A65242}})

48 – 4800
52 – 5200
56 – 5600

S = Module type

U – Unbuffered DIMM (non-ECC)
S – SODIMM, unbuffered (non-ECC)

40B = CAS latency

40B – CL40-39-39
42 – CL42-42-42
46B – CL46-45-45

D = Ranks

S – Single rank
D – Dual rank

8 = DRAM type

8 – x8
6 – x16

M = DRAM manufacturer

H – SK Hynix
M – Micron
S – Samsung

A = DRAM die revision

A – A die
B – B die
M – M die

32 = Total capacity

8 – 8GB
16 – 16GB
32 – 32GB

Part number: CBD26D4U9D8HJV-16

CBD = Product line

CBD – Kingston design-in DRAM module

26 = Speed (MT/s{{Footnote.A65242}})

21 – 2133
24 – 2400
26 – 2666
32 – 3200

D4 = Technology

D4 – DDR4

U = Module type

U – Unbuffered DIMM (non-ECC)
S – SODIMM, unbuffered (non-ECC)

9 = CAS latency

5 – CL15-15-15
7 – CL17-17-17
9 – CL19-19-19
2 – CL22-22-22

D = Ranks

S – Single rank
D – Dual rank

8 = DRAM type

8 – x8
1 – x16

H = DRAM manufacturer

H – SK Hynix
K – Kingston
M – Micron
N – Nanya
S – Samsung

J = DRAM die revision

A – A die
B – B die
C – C die
D – D die
E – E die
F – F die
H – H die
J – J die
R – R die

V = PCB type

Black – Flash gold
H – Hard gold
V – Very low profile

16 = Total capacity

4 – 4GB
8 – 8GB
16 – 16GB
32 – 32GB

Part number: CBD16D3LFU1KBG/2G

CBD = Product line

CBD – Kingston design-in DRAM module

16 = Speed (MT/s{{Footnote.A65242}})

16 – 1600

D3L = Technology

D3 – DDR3 (1.5V)
D3L – DDR3L (1.35V / 1.5V)

F = DRAM type

Blank – x8
F – x16

U = Module type

U – Unbuffered DIMM (non-ECC)
S – SODIMM, unbuffered (non-ECC)

1 = CAS latency

1 – CL11-11-11

K = DRAM manufacturer

K – Kingston
S – Samsung

B = DRAM die revision

B – B die
D – D die
E – E die

G = PCB type

L – Very low profile
G – Green (RoHS compliant)
H – Hard gold

2G = Total capacity

2G – 2 GB
4G – 4 GB
8G – 8 GB

Part number: HX429C15PB3AK4/32

HX = Product line

HX - HyperX (Legacy)

4 = Technology

3 - DDR3
4 - DDR4

29 = Speed (MT/s{{Footnote.A65242}})

13 - 1333
16 - 1600
18 - 1866
21 - 2133
24 - 2400
26 - 2666
28 - 2800
29 - 2933
30 - 3000
32 - 3200
33 - 3333
34 - 3466
36 - 3600
37 - 3733
40 - 4000
41 - 4133
42 - 4266
46 - 4600
48 - 4800
50 - 5000
51 - 5133
53 - 5333

C = DIMM type

C - UDIMM (Non-ECC Unbuffered)
S - SODIMM (Non-ECC Unbuffered)

15 = CAS latency

9 - CL9
10 - CL10
11 - CL11
12 - CL12
13 - CL13
14 - CL14
15 - CL15
16 - CL16
17 - CL17
18 - CL18
19 - CL19
20 - CL20

P = Series

F - FURY
B - Beast
S - Savage
P - Predator
I - Impact

B = Heat spreader

Blank - Blue
B - Black
R - Red
W - White

3 = Revision

2 - 2nd revision
3 - 3rd revision
4 - 4th revision

A = RGB

Blank - Non-RGB
A - RGB

K4 = Kit + Number of pieces

Blank – Single module
K2 - Kit of 2 modules
K4 - Kit of 4 modules
K8 - Kit of 8 modules

32 = Total capacity

4 - 4GB
8 - 8GB
16 - 16GB
32 - 32GB
64 - 64GB
128 - 128GB
256 - 256GB

Part Number: KVR16LR11D8LK2/4HB

KVR = Kingston ValueRAM

KVR - Kingston ValueRAM

16 = Speed (MT/s{{Footnote.A65242}})

16 - 1600
13 - 1333
10 - 1066

L = Low Voltage

blank - 1.5V
L - 1.35V
U - 1.25V

R = Module Type

E - Unbuffered DIMM (ECC)
N - Unbuffered DIMM (non-ECC)
R - Registered DIMM
L - Load-Reduced DIMM
S - SO-DIMM

11 = CAS Latency

11 - CAS Latency

D = Ranks

S - Single Rank
D - Dual Rank
Q - Quad Rank

8 = DRAM Type

4 - x4 DRAM chip
8 - x8 DRAM chip

L = Profile

L - 18.75mm (VLP)
H - 30mm

K2 = Kit + Number of pieces

K2 - Kit of Two Modules
K3 - Kit of Three Modules
K4 - Kit of Four Modules

4 = Capacity

4 - 4GB
8 - 8GB
12 - 12GB
16 - 16GB
24 - 24GB
32 - 32GB
48 - 48GB
64 - 64GB

H = DRAM MFGR/Certification

H - Hynix
E - Elpida
I - Intel Certified

B = Die Revision

B - Die Revision

Part Number: KVR1066D3LD8R7SLK2/46HB

KVR
1066
D3
L
D
8
R
7
S
L
K2
/
4G
H
B

KVR = Kingston ValueRAM

KVR - Kingston ValueRAM

1066 = Speed (MT/s{{Footnote.A65242}})

1066 - Speed

D3 = Technology

D2 - DDR2
D3 - DDR3

L = Low Voltage

blank - 1.5V
L - 1.35V
U - 1.25V

D = Ranks

S - Single Rank
D - Dual Rank
Q - Quad Rank

8 = DRAM

4 - x4 DRAM chip
8 - x8 DRAM chip

R = Module Type

P - Parity on Register (for registered modules only)
E - Unbuffered DIMM (ECC)
F - FB DIMM
M - Mini-DIMM
N - Unbuffered DIMM (non-ECC)
R - Registered DIMM with Address/Command Parity Function
S - SO-DIMM
U - Micro-DIMM

7 = CAS Latency

7: CAS Latency

S = Thermal Sensor

blank – Without Thermal Sensor
S – With Thermal Sensor

L = Profile

blank – Any height
L – 18.75mm (VLP)
H – 30mm

K2 = Kit + Number of pieces

blank – Single Module
K2 – Kit of Two Modules
K3 – Kit of Three Modules

4G = Capacity

4G: Capacity

H = DRAM MFGR

H: DRAM MFGR

Part Number: KVR400X72RC3AK2/1G

KVR = Kingston ValueRAM

KVR - Kingston ValueRAM

400 = Speed (MT/s{{Footnote.A65242}})

X72 = X72 ECC

X72 - X72 ECC

R = Registered

R - Registered

C3 = CAS Latency

C3 - CAS Latency

A = DDR400 3-3-3

A - DDR400 3-3-3

K2 = Kit + Number of pieces

K2 - Kit of Two Modules

1G = Capacity

1G - Capacity

Latency timing

The information below will help illustrate the various settings that can be adjusted when setting the memory timings in the motherboard BIOS for optimum performance. Please note that these settings may vary depending on motherboard make/model or BIOS firmware version.

Sample

CAS Latency (CL): Delay between activation of a row and the reading of that row.

RAS to CAS or RAS to Column Delay (tRCD): Activates the row

Row Precharge Delay or RAS Precharge Delay (tRP/tRCP): Deactivates the row

Row Active Delay or RAS Active Delay or time to ready (tRA/tRD/tRAS): Number of clock cycles between activation/deactivation of row.

Disclaimer: All Kingston products are tested to meet our published specifications. Some systems or motherboard configurations may not operate at the published Kingston memory speeds and timing settings. Kingston does not recommend that users attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.